Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation
In this study, we use Moldex3D warpage and stress analysis to predict strip warpage by focusing on the PMC process and applying three distinct material models to ensure simulation accuracy, since deformation under high-temperature loading is highly sensitive to material behavior and demands precise...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2025-06-01
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| Col·lecció: | Results in Engineering |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2590123025013933 |
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