Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering
In order to use mechanism model analysis instead of experimental test to control and adjust the temperature and oven temperature curve of each part of the integrated circuit board reflow oven to make it meet the process requirements, a fitting algorithm was used to establish a heat transfer model of...
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| Autori principali: | , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
IEEE
2021-01-01
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| Serie: | IEEE Access |
| Soggetti: | |
| Accesso online: | https://ieeexplore.ieee.org/document/9576114/ |
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