Detection and Prediction of Chipping in Wafer Grinding Based on Dicing Signal

Simple regression cannot wholly analyze large-scale wafer backside wall chipping because the wafer grinding process encounters many problems, such as collected data missing, data showing a non-linear distribution, and correlated hidden parameters lost. The objective of this study is to propose a nov...

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Principais autores:	Bao Rong Chang, Hsiu-Fen Tsai, Hsiang-Yu Mo
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2022-12-01
coleção:	Mathematics
Assuntos:	wafer grinding backside wall chipping importance analysis random forest dimensionality reduction Data Driven-Bidirectional LSTM
Acesso em linha:	https://www.mdpi.com/2227-7390/10/24/4631
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