Detection and Prediction of Chipping in Wafer Grinding Based on Dicing Signal
Simple regression cannot wholly analyze large-scale wafer backside wall chipping because the wafer grinding process encounters many problems, such as collected data missing, data showing a non-linear distribution, and correlated hidden parameters lost. The objective of this study is to propose a nov...
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| Hauptverfasser: | , , |
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| Format: | Artigo |
| Sprache: | Inglês |
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MDPI AG
2022-12-01
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| Schriftenreihe: | Mathematics |
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| Online-Zugang: | https://www.mdpi.com/2227-7390/10/24/4631 |
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