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Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications
With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively,...
Guardado en:
| Publicado en: | Polymers (Basel) |
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| Autores principales: | , , , , , , , , , |
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7796458/ https://ncbi.nlm.nih.gov/pubmed/33466509 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym13010169 |
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