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Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications
With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively,...
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| Vydáno v: | Polymers (Basel) |
|---|---|
| Hlavní autoři: | , , , , , , , , , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI
2021
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7796458/ https://ncbi.nlm.nih.gov/pubmed/33466509 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym13010169 |
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