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The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography
The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique use...
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| Vydáno v: | Chem Mater |
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| Hlavní autoři: | , , , , , , , , , , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
2020
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7580231/ https://ncbi.nlm.nih.gov/pubmed/33100517 |
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