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The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography

The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique use...

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Detalhes bibliográficos
Publicado no:Chem Mater
Main Authors: Sunday, Daniel F., Chen, Xuanxuan, Albrecht, Thomas R., Nowak, Derek, Delgadillo, Paulina Rincon, Dazai, Takahiro, Miyagi, Ken, Maehashi, Takaya, Yamazaki, Akiyoshi, Nealey, Paul F., Kline, R. Joseph
Formato: Artigo
Idioma:Inglês
Publicado em: 2020
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC7580231/
https://ncbi.nlm.nih.gov/pubmed/33100517
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