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Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling
The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO(2) cover...
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| Publicado no: | Materials (Basel) |
|---|---|
| Main Authors: | , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2020
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7559374/ https://ncbi.nlm.nih.gov/pubmed/32899878 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma13183926 |
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