Park, E., Seifert, M., Rane, G. K., Menzel, S. B., Gemming, T., & Nielsch, K. (2020). Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling. Materials (Basel).
استشهاد بنمط شيكاغوPark, Eunmi, Marietta Seifert, Gayatri K. Rane, Siegfried B. Menzel, Thomas Gemming, و Kornelius Nielsch. "Stress and Microstructure Evolution in Mo Thin Films Without or With Cover Layers During Thermal-Cycling." Materials (Basel) 2020.
MLA استشهادPark, Eunmi, et al. "Stress and Microstructure Evolution in Mo Thin Films Without or With Cover Layers During Thermal-Cycling." Materials (Basel) 2020.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.