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Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range
The electrical conductivity of nanocomposite Sn-3.0Ag-0.5Cu alloys with two different weight percentages of Ni nanoparticles (1.0 and 2.0 wt.%) was measured over a wide temperature range. The samples were produced using a cold pressing method: Sn-3.0Ag-0.5Cu powder and Ni nanopowder were mechanicall...
Gorde:
| Argitaratua izan da: | J Phase Equilibria Diffus |
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| Egile Nagusiak: | , , , , , |
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
Springer US
2017
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| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6979714/ https://ncbi.nlm.nih.gov/pubmed/32025225 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1007/s11669-017-0532-0 |
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