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Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room...
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| Publicat a: | Materials (Basel) |
|---|---|
| Autors principals: | , , , , , |
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI
2019
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| Matèries: | |
| Accés en línia: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6862243/ https://ncbi.nlm.nih.gov/pubmed/31684157 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma12213609 |
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