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Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb
The effect of recrystallization of 99.3Sn–0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples...
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| Izdano u: | Materials (Basel) |
|---|---|
| Glavni autori: | , , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI
2020
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| Teme: | |
| Online pristup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7078776/ https://ncbi.nlm.nih.gov/pubmed/32098085 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma13040968 |
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