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Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon
Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and perform...
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| Publicat a: | Micromachines (Basel) |
|---|---|
| Autors principals: | , , , , |
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI
2019
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| Matèries: | |
| Accés en línia: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6780082/ https://ncbi.nlm.nih.gov/pubmed/31527434 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10090616 |
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