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A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process
This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable pro...
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| Veröffentlicht in: | Micromachines (Basel) |
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| Hauptverfasser: | , , , , , , |
| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
MDPI
2019
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| Schlagworte: | |
| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6630974/ https://ncbi.nlm.nih.gov/pubmed/31181589 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10060380 |
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