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Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging
High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have co...
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| 出版年: | Sci Rep |
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| 主要な著者: | , , , , |
| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Nature Publishing Group UK
2019
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6629638/ https://ncbi.nlm.nih.gov/pubmed/31308462 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-019-46757-w |
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