APA Alıntı

Shen, Y., Lin, C., Li, J., Gao, R., & Nishikawa, H. (2019). Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging. Sci Rep.

Chicago Stili Alıntı

Shen, Yu-An, Chun-Ming Lin, Jiahui Li, Runhua Gao, ve Hiroshi Nishikawa. "Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound At Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate During Solid-state Aging." Sci Rep 2019.

MLA Alıntı

Shen, Yu-An, et al. "Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound At Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate During Solid-state Aging." Sci Rep 2019.