APA-viite

Shen, Y., Lin, C., Li, J., Gao, R., & Nishikawa, H. (2019). Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging. Sci Rep.

Chicago-tyylinen lähdeviittaus

Shen, Yu-An, Chun-Ming Lin, Jiahui Li, Runhua Gao, ja Hiroshi Nishikawa. "Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound At Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate During Solid-state Aging." Sci Rep 2019.

MLA-viite

Shen, Yu-An, et al. "Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound At Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate During Solid-state Aging." Sci Rep 2019.

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