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PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to othe...

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Detalhes bibliográficos
Publicado no:Micromachines (Basel)
Main Authors: Ahmad, Mansoor, Bozkurt, Ayhan, Farhanieh, Omid
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2019
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC6562750/
https://ncbi.nlm.nih.gov/pubmed/31083578
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10050319
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