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The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on...
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| Publicado no: | Materials (Basel) |
|---|---|
| Main Authors: | , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2019
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6470899/ https://ncbi.nlm.nih.gov/pubmed/30909434 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma12060960 |
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