APA Citation

Kang, M., Kim, D., & Shin, Y. (2019). The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints. Materials (Basel).

Citação norma Chicago

Kang, Min-Soo, Do-Seok Kim, and Young-Eui Shin. "The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints." Materials (Basel) 2019.

MLA Citation

Kang, Min-Soo, Do-Seok Kim, and Young-Eui Shin. "The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints." Materials (Basel) 2019.

Advarsel: Disse citationer er muligvist ikke 100% nøjagtige.