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Thermal transport across grain boundaries in polycrystalline silicene: A multiscale modeling
During the fabrication process of large scale silicene, through common chemical vapor deposition (CVD) technique, polycrystalline films are quite likely to be produced, and the existence of Kapitza thermal resistance along grain boundaries could result in substantial changes of their thermal propert...
Guardat en:
| Publicat a: | Sci Rep |
|---|---|
| Autors principals: | , , |
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Nature Publishing Group UK
2019
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| Matèries: | |
| Accés en línia: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6450874/ https://ncbi.nlm.nih.gov/pubmed/30952974 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-019-42187-w |
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