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Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal co...
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| 出版年: | Polymers (Basel) |
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| 主要な著者: | , , |
| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI
2018
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6414828/ https://ncbi.nlm.nih.gov/pubmed/30966375 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym10030340 |
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