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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
In this study, the feasibility of low-cost Cu-sintering technology for power electronics packaging and the effect of sintering conditions on the bonding strength of the Cu-sintered joint have been evaluated. A Cu paste with nano-sized Cu powders and a metal content of ~78% as a high-temperature bond...
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| Vydáno v: | Materials (Basel) |
|---|---|
| Hlavní autoři: | , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI
2018
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6266767/ https://ncbi.nlm.nih.gov/pubmed/30373139 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma11112105 |
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