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An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices
Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by c...
Gorde:
| Argitaratua izan da: | Micromachines (Basel) |
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| Egile Nagusiak: | , , |
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
MDPI
2016
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| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6189769/ https://ncbi.nlm.nih.gov/pubmed/30404382 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi7110211 |
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