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Use of Vacuum Bagging for Fabricating Thermoplastic Microfluidic Devices
In this work we present a novel thermal bonding method for thermoplastic microfluidic devices. This simple method employs a modified vacuum bagging technique, a concept borrowed from the aerospace industry, to produce conventional thick substrate microfluidic devices, as well as multi-layer film dev...
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| Veröffentlicht in: | Lab Chip |
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| Hauptverfasser: | , , , , |
| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
2015
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| Schlagworte: | |
| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4256099/ https://ncbi.nlm.nih.gov/pubmed/25329244 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1039/c4lc00927d |
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