Cita APA

Gong, Y., Park, J. M., & Lim, J. (2016). An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices. Micromachines (Basel).

Chicago Style Citation

Gong, Yao, Jang Min Park, i Jiseok Lim. "An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices." Micromachines (Basel) 2016.

Cita MLA

Gong, Yao, Jang Min Park, i Jiseok Lim. "An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices." Micromachines (Basel) 2016.