Loading...
Stress Distribution Profile Imaging With Spectral Fabry-Perot Interferometry in Thin Layer Substrates for Surface Micromachining
We have used spectral two-layer interferometry (STLI) imaging for estimation of the stress distribution profiles (SDPs) in thin film substrates, enabling fast and reliable all-optical methodology for the evaluation of pre-stress topography profiles in silicon wafers deposited with thin films. Specif...
Na minha lista:
| Udgivet i: | Micromachines (Basel) |
|---|---|
| Main Authors: | , |
| Format: | Artigo |
| Sprog: | Inglês |
| Udgivet: |
MDPI
2017
|
| Fag: | |
| Online adgang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6189764/ https://ncbi.nlm.nih.gov/pubmed/30400485 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi8100294 |
| Tags: |
Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!
|