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Stress Distribution Profile Imaging With Spectral Fabry-Perot Interferometry in Thin Layer Substrates for Surface Micromachining
We have used spectral two-layer interferometry (STLI) imaging for estimation of the stress distribution profiles (SDPs) in thin film substrates, enabling fast and reliable all-optical methodology for the evaluation of pre-stress topography profiles in silicon wafers deposited with thin films. Specif...
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| Vydáno v: | Micromachines (Basel) |
|---|---|
| Hlavní autoři: | , |
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI
2017
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6189764/ https://ncbi.nlm.nih.gov/pubmed/30400485 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi8100294 |
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