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Hard-Baked Photoresist as a Sacrificial Layer for Sub-180 °C Surface Micromachining Processes
This letter proposes a method for utilizing a positive photoresist, Shipley 1805, as a sacrificial layer for sub-180 °C fabrication process flows. In the proposed process, the sacrificial layer is etched at the end to release the structures using a relatively fast wet-etching technique employing res...
Shranjeno v:
| izdano v: | Micromachines (Basel) |
|---|---|
| Main Authors: | , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI
2018
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| Teme: | |
| Online dostop: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6187695/ https://ncbi.nlm.nih.gov/pubmed/30424164 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi9050231 |
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