Enhanced Ti(0.84)Ta(0.16)N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers

We compare the performance of conventional DC magnetron sputter-deposited (DCMS) TiN diffusion barriers between Cu overlayers and Si(001) substrates with Ti(0.84)Ta(0.16)N barriers grown by hybrid DCMS/high-power impulse magnetron sputtering (HiPIMS) with substrate bias synchronized to the metal-ric...

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發表在:Sci Rep
Main Authors: Mühlbacher, Marlene, Greczynski, Grzegorz, Sartory, Bernhard, Schalk, Nina, Lu, Jun, Petrov, Ivan, Greene, J. E., Hultman, Lars, Mitterer, Christian
格式: Artigo
語言:Inglês
出版: Nature Publishing Group UK 2018
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Article
在線閱讀:https://ncbi.nlm.nih.gov/pmc/articles/PMC5876326/
https://ncbi.nlm.nih.gov/pubmed/29599468
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-018-23782-9
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