Mühlbacher, M., Greczynski, G., Sartory, B., Schalk, N., Lu, J., Petrov, I., . . . Mitterer, C. (2018). Enhanced Ti(0.84)Ta(0.16)N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers. Sci Rep.

Mühlbacher, Marlene, Grzegorz Greczynski, Bernhard Sartory, Nina Schalk, Jun Lu, Ivan Petrov, J. E. Greene, Lars Hultman, و Christian Mitterer. "Enhanced Ti(0.84)Ta(0.16)N Diffusion Barriers, Grown By a Hybrid Sputtering Technique With No Substrate Heating, between Si(001) Wafers and Cu Overlayers." Sci Rep 2018.

Mühlbacher, Marlene, et al. "Enhanced Ti(0.84)Ta(0.16)N Diffusion Barriers, Grown By a Hybrid Sputtering Technique With No Substrate Heating, between Si(001) Wafers and Cu Overlayers." Sci Rep 2018.