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Enhanced Ti(0.84)Ta(0.16)N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers
We compare the performance of conventional DC magnetron sputter-deposited (DCMS) TiN diffusion barriers between Cu overlayers and Si(001) substrates with Ti(0.84)Ta(0.16)N barriers grown by hybrid DCMS/high-power impulse magnetron sputtering (HiPIMS) with substrate bias synchronized to the metal-ric...
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| Udgivet i: | Sci Rep |
|---|---|
| Main Authors: | , , , , , , , , |
| Format: | Artigo |
| Sprog: | Inglês |
| Udgivet: |
Nature Publishing Group UK
2018
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| Fag: | |
| Online adgang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5876326/ https://ncbi.nlm.nih.gov/pubmed/29599468 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-018-23782-9 |
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