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Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

Fracture and breakage of single crystals, particularly of silicon wafers, are multi-scale problems: the crack tip starts propagating on an atomic scale with the breaking of chemical bonds, forms crack fronts through the crystal on the micrometre scale and ends macroscopically in catastrophic wafer s...

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Dettagli Bibliografici
Pubblicato in:IUCrJ
Autori principali: Rack, Alexander, Scheel, Mario, Danilewsky, Andreas N.
Natura: Artigo
Lingua:Inglês
Pubblicazione: International Union of Crystallography 2016
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Accesso online:https://ncbi.nlm.nih.gov/pmc/articles/PMC4775159/
https://ncbi.nlm.nih.gov/pubmed/27006774
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1107/S205225251502271X
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