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Thickness scaling of atomic-layer-deposited HfO(2) films and their application to wafer-scale graphene tunnelling transistors
The downscaling of the capacitance equivalent oxide thickness (CET) of a gate dielectric film with a high dielectric constant, such as atomic layer deposited (ALD) HfO(2), is a fundamental challenge in achieving high-performance graphene-based transistors with a low gate leakage current. Here, we as...
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| Publicado no: | Sci Rep |
|---|---|
| Main Authors: | , , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4748263/ https://ncbi.nlm.nih.gov/pubmed/26861833 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep20907 |
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