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Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection of surface mount packages is crucial in the electronics manufacturing industry. In this study we demonstrate the feasibility of using a 230 MHz ultrasonic transducer for nondestruct...
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| Main Authors: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Molecular Diversity Preservation International (MDPI)
2013
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3892821/ https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s131216281 |
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