A carregar...
Carbon nanotube bumps for the flip chip packaging system
Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. Th...
Na minha lista:
| Main Authors: | , , , , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Springer
2012
|
| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3338392/ https://ncbi.nlm.nih.gov/pubmed/22313721 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/1556-276X-7-105 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|