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Copper-selective electrochemical filling of macropore arrays for through-silicon via applications
In this article, the physico-chemical and electrochemical conditions of through-silicon via formation were studied. First, macropore arrays were etched through a low doped n-type silicon wafer by anodization under illumination into a hydrofluoric acid-based electrolyte. After electrochemical etching...
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| Main Authors: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Springer
2012
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3414756/ https://ncbi.nlm.nih.gov/pubmed/22776559 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/1556-276X-7-375 |
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