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High-Density Stretchable Electronics: Toward an Integrated Multilayer Composite

High-density stretchable electronics is achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics—increasing integration density and improving electrical bonding—have been addressed by our innovative multilayer via-bonding techn...

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Dades bibliogràfiques
Autors principals: Guo, Liang, DeWeerth, Stephen P.
Format: Artigo
Idioma:Inglês
Publicat: 2010
Matèries:
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC3271703/
https://ncbi.nlm.nih.gov/pubmed/20717983
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adma.201000515
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