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High-Density Stretchable Electronics: Toward an Integrated Multilayer Composite
High-density stretchable electronics is achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics—increasing integration density and improving electrical bonding—have been addressed by our innovative multilayer via-bonding techn...
Gorde:
| Egile Nagusiak: | , |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
2010
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| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3271703/ https://ncbi.nlm.nih.gov/pubmed/20717983 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adma.201000515 |
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