Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys...

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Главные авторы: Gyenes A., Simon A., Lanszki P., Gácsi Z.
Формат: Artigo
Язык:Inglês
Опубликовано: Polish Academy of Sciences 2015-06-01
Серии:Archives of Metallurgy and Materials
Предметы:
Sn-0.7Cu
lead-free solder
Ni addition
microstructure
mechanical properties
Online-ссылка:http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INT
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