Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys...

पूर्ण विवरण

में बचाया:
ग्रंथसूची विवरण
मुख्य लेखकों: Gyenes A., Simon A., Lanszki P., Gácsi Z.
स्वरूप: Artigo
भाषा:Inglês
प्रकाशित: Polish Academy of Sciences 2015-06-01
श्रृंखला:Archives of Metallurgy and Materials
विषय:
Sn-0.7Cu
lead-free solder
Ni addition
microstructure
mechanical properties
ऑनलाइन पहुंच:http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INT
टैग : टैग जोड़ें
कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!

समान संसाधन