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Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders
This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys...
Tallennettuna:
| Päätekijät: | , , , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
Polish Academy of Sciences
2015-06-01
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| Sarja: | Archives of Metallurgy and Materials |
| Aiheet: | |
| Linkit: | http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INT |
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