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Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered microporous Ag and multi-layer surface metallization. Silicon carbide particles (SiC<sub>p</sub>) were added into the Ag sinter joining paste to improve the high-temperature reli...
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| Main Authors: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2018-12-01
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| Colecção: | Materials |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/1996-1944/11/12/2531 |
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