Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors

Por Seungjun Noh, Hao Zhang, Katsuaki Suganuma
Publicado em 2018-12-01

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Por Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma
Publicado em 2019-10-01

The Surface Coating of Commercial LiFePO4 by Utilizing ZIF-8 for High Electrochemical Performance Lithium Ion Battery

Por XiaoLong Xu, CongYu Qi, ZhenDong Hao, Hao Wang, JinTing Jiu, JingBing Liu, Hui Yan, Katsuaki Suganuma
Publicado em 2017-09-01