Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip

We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering assembly at 260 °C. By utilizing a TaN–Ta interfacial layer (IL), the...

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Autori principali: Peng Yuan, Danian Dong, Xu Zheng, Guozhong Xing, Xiaoxin Xu
Natura: Artigo
Lingua:Inglês
Pubblicazione: MDPI AG 2022-03-01
Serie:Micromachines
Soggetti:
RRAM
thermal stability
reflow soldering
retention
Accesso online:https://www.mdpi.com/2072-666X/13/4/567
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