Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films
Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increase...
שמור ב:
| הוצא לאור ב: | Journal of Applied Research and Technology |
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| Principais autores: | , , , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
Universidad Nacional Autónoma de México
2018
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| נושאים: | |
| גישה מקוונת: | https://www.redalyc.org/articulo.oa?id=47471671002 https://www.redalyc.org/journal/474/47471671002/ https://www.redalyc.org/journal/474/47471671002/html/ https://www.redalyc.org/journal/474/47471671002/47471671002.epub https://www.redalyc.org/journal/474/47471671002/movil |
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