Pulsed DC Sputter Deposition of Stable Turbostratic Boron Nitride Thin Films

ABSTRACT Boron nitride (BN) is considered for several applications in microelectronics, such as thermal management, optoelectronics, or as memristors. BN can be deposited with different deposition methods, but any integration in the back‐end‐of‐the‐line limits the deposition temperature to approxima...

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Autors principals:	Josef Schätz, Michael Krenzer, Tim Schaffus, Martin Otto, Fabian Kühnel, Fabian Streb, Günther Benstetter, Georg S. Duesberg, Stephan Pindl, Max C. Lemme
Format:	Artigo
Idioma:	Inglês
Publicat:	Wiley-VCH 2026-04-01
Col·lecció:	Advanced Materials Interfaces
Matèries:	boron nitride pulsed DC sputtering sputtering substrate biasing
Accés en línia:	https://doi.org/10.1002/admi.202501038
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