Research progress of high thermal conductivity diamond/copper composites
SignificanceWith the continuous advancement of electronic devices toward miniaturization, integration, and high-power density, the significant increase in power density has made efficient thermal management essential for ensuring stable device operation. Due to its exceptional thermal conductivity,...
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| 主要な著者: | , , , , , |
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| フォーマット: | Artigo |
| 言語: | Chinês |
| 出版事項: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2025-10-01
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| シリーズ: | Jin'gangshi yu moliao moju gongcheng |
| 主題: | |
| オンライン･アクセス: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2025.0074 |
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