Research progress in interface optimization and preparation technology of high thermal conductivity diamond/copper composite materials
With the miniaturization and integration of microelectronic components, the demand for high-thermal-conductivity electronic packaging materials has grown substantially. Diamond/copper (Dia/Cu) composites have become a focus of research due to their ultra-high thermal conductivity and low coefficient...
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| Asıl Yazarlar: | , , , , , , |
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| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Frontiers Media S.A.
2025-04-01
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| Seri Bilgileri: | Frontiers in Materials |
| Konular: | |
| Online Erişim: | https://www.frontiersin.org/articles/10.3389/fmats.2025.1582990/full |
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