Research progress in interface optimization and preparation technology of high thermal conductivity diamond/copper composite materials
With the miniaturization and integration of microelectronic components, the demand for high-thermal-conductivity electronic packaging materials has grown substantially. Diamond/copper (Dia/Cu) composites have become a focus of research due to their ultra-high thermal conductivity and low coefficient...
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| Autors principals: | , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Frontiers Media S.A.
2025-04-01
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| Col·lecció: | Frontiers in Materials |
| Matèries: | |
| Accés en línia: | https://www.frontiersin.org/articles/10.3389/fmats.2025.1582990/full |
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